Inventor Blog PH

Autodesk just acquired Plassotech. Read the press release here. Currently, the FEA solution built-in with Autodesk Inventor Simulation Suite 2008 and Autodesk Inventor Professional 2008 is powered by Ansys technology. Ansys is a global leader in CAE. It seems that FEA tools in 3G Author will replace the existing FEA tools powered by Ansys. I guess they’ll be coming up with something that would answer the needs of the semi-conductor industry and others that need thermal stress analysis.

Service Pack 1 for all flavors of Autodesk Inventor 2008 . Download it now and apply the patch. Most of the issues addressed in this patch concerns with the Drawing Manager. Read more of the issues being addressed here.

Autodesk Solutions Day was held last week at Crowne Plaza and the four ballrooms were filled with participants from different industries such as AEC, Infrastructure, Manufacturing, and Media and Entertainment. The famous Lynn Allen was there to present AutoCAD 2008.

I just checked the Autodesk’s Manufacturing Community website and I was surprised seeing my name there in the front page of the site. My design portfolio is featured there. Hehe. I haven’t uploaded my other designs there. I guess I’ll upload all of them in the following days to come.

The announcement of Autodesk Inventor LT has been a surprise for me. You may download it for free to use for a limited time only from the Autodesk Labs website. You may have a preview of the functions of Inventor LT here. Basically, Autodesk Inventor LT is a stripped down version of Autodesk Inventor Suite. In Autodesk Inventor LT, one could create the following:

• 3D Part models
• Part Drawings
• Photorealistic Renderings
• Publish DWF files
• Native 3D multi-CAD Export and Import
• Native 3D multi-CAD translation (see Autodesk Labs website)

NOTE: This is available for download in the following countries: United States, Canada, the United Kingdom, Australia and New Zealand. Too bad I cannot download and test it here in the Philippines.