Autodesk went shopping again

August 29, 2007 at 11:33 pm Leave a comment

Autodesk just acquired Plassotech. Read the press release here. Currently, the FEA solution built-in with Autodesk Inventor Simulation Suite 2008 and Autodesk Inventor Professional 2008 is powered by Ansys technology. Ansys is a global leader in CAE. It seems that FEA tools in 3G Author will replace the existing FEA tools powered by Ansys. I guess they’ll be coming up with something that would answer the needs of the semi-conductor industry and others that need thermal stress analysis. 🙂


Entry filed under: News.

Testing Project Freewheel’s Online Collaboration File Renaming in Vault

Leave a Reply

Fill in your details below or click an icon to log in: Logo

You are commenting using your account. Log Out /  Change )

Google+ photo

You are commenting using your Google+ account. Log Out /  Change )

Twitter picture

You are commenting using your Twitter account. Log Out /  Change )

Facebook photo

You are commenting using your Facebook account. Log Out /  Change )

Connecting to %s

Trackback this post  |  Subscribe to the comments via RSS Feed

Flickr Photos

%d bloggers like this: