Autodesk went shopping again

August 29, 2007 at 11:33 pm Leave a comment

Autodesk just acquired Plassotech. Read the press release here. Currently, the FEA solution built-in with Autodesk Inventor Simulation Suite 2008 and Autodesk Inventor Professional 2008 is powered by Ansys technology. Ansys is a global leader in CAE. It seems that FEA tools in 3G Author will replace the existing FEA tools powered by Ansys. I guess they’ll be coming up with something that would answer the needs of the semi-conductor industry and others that need thermal stress analysis. 🙂

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Entry filed under: News.

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